Manufacturers Listed Alphabetically

Production DIP or SIP Packages

Includes 1-, 2-, 4-, or 6-beam, LIF, ZIF, and surface mount DIP

Production BGA Sockets

Production LGA Sockets

For desktop, notebook and PC server applications

Production PGA Sockets

Includes machined, stamped and formed (ZIF) terminal

Production Chip Carrier Sockets

Includes LCC (Leadless Chip Carrier), PLCC, CLCC, and other chip carriers

Production Fine Pitch Sockets

Includes PQFP (Fine Pitch Quad Flatpack) and other fine pitch

Production Memory Modules

Includes SIMM, DIMM, S.O., DDR (.050 and .1mm centers), DDR II, RIMM, S.O. RIMM, and custom memory modules

Production SOIC/SOJ/SOP Sockets

Production ZIP/ZIL Sockets

Production - Other and Custom Sockets

Test & Burn-in BGA Sockets

Test & Burn-in LGA Sockets

Test & Burn-in PGA Sockets

Includes .050 and .100 pitch

Test & Burn-in Chip Carriers

Includes LLC (Leadless Chip Carrier), PLCC, CLCC, and other chip carriers

Test & Burn-in - All Other Sockets

Includes DIP, SIMM, SOP/SOIC/SOJ, micro BGA/fine pitch, MLC, QFN/MLF sockets, discrete sockets, emerging array contactors, and other test and burn-in sockets